Capabilities
- Automated surface mount assembly
- Through hole electronic assembly
- Hand Soldering
- Potting (encapsulation)
- Wave Soldering
- Leaded and RoHS processes
- IPC Assembly Standards
- Electromechanical assembly (such as box build)
- Electronic testing
- Functional test development
- Re-manufacturing
- Electronic design services
- Reverse-engineering support
- Obsolete design services
- Prototype builds
- Inventory Management (Material procurement, Kanban, Drop ship to your customer)
- New Product Introduction (NPI)
