Capabilities

  • Automated surface mount assembly
  • Through hole electronic assembly
  • Hand Soldering
  • Potting (encapsulation)
  • Wave Soldering
  • Leaded and RoHS processes
  • IPC Assembly Standards
  • Electromechanical assembly (such as box build)
  • Electronic testing
  • Functional test development
  • Re-manufacturing
  • Electronic design services
  • Reverse-engineering support
  • Obsolete design services
  • Prototype builds
  • Inventory Management (Material procurement, Kanban, Drop ship to your customer)
  • New Product Introduction (NPI)

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